Hiroyuki Kon

Title: Hiroyuki Kon: Innovator in Electrodeposited Copper Foil Technology

Introduction

Hiroyuki Kon is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of materials science, particularly in the development of electrodeposited copper foil technology. His innovative work has led to advancements that enhance the performance and reliability of electronic components.

Latest Patents

Hiroyuki Kon holds a patent for an "Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof." This invention provides a solution to ensure high bonding strength between the surface of the bulk copper layer and a resin substrate layer, even when the surface roughness is low. The design minimizes the risk of delamination, even in the presence of pinholes or similar defects after exposure to desmear solutions. The structure of the electrodeposited copper foil includes a bonding interface layer, a bulk copper layer, a plated Ni–Zn alloy layer, and a primer resin layer, all formed in a specific order on at least one surface of the carrier foil.

Career Highlights

Hiroyuki Kon is associated with Mitsui Mining & Smelting Company, Ltd., where he has been instrumental in advancing the company's technological capabilities. His work has not only contributed to the company's portfolio but has also positioned it as a leader in the materials industry.

Collaborations

Hiroyuki has collaborated with esteemed colleagues such as Tetsuhiro Matsunaga and Toshifumi Matsushima. Their combined expertise has fostered an environment of innovation and has led to the successful development of new technologies in their field.

Conclusion

Hiroyuki Kon's contributions to the field of electrodeposited copper foil technology exemplify the impact of innovative thinking in materials science. His patent reflects a commitment to enhancing product performance and reliability in electronic applications.