Location History:
- Ibaraki, JP (1986 - 1990)
- Ibaraki, Osaka, JP (1991)
- Osaka, JP (1984 - 2011)
Company Filing History:
8 out of 27,375 
6 out of 1,858 
2 out of 16,453 
Years Active: 1984-2011
Title: Kenichi Nishino: Innovator in Electronic Component Mounting Technology
Introduction
Kenichi Nishino is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of electronic component mounting technology. With a total of 17 patents to his name, Nishino has developed innovative solutions that enhance productivity in manufacturing processes.
Latest Patents
Nishino's latest patents include a heating and pressurizing apparatus designed for use in mounting electronic components. This apparatus allows for a circuit board with pre-bonded electronic components to be processed efficiently. The technology enables the post-bonding of electronic components to the circuit board by heating and pressurizing them through a contact member equipped with a heating device. By separating the pre-bonding and post-bonding processes, the time required for post-bonding is significantly reduced, leading to improved productivity on the mounting line.
Career Highlights
Throughout his career, Kenichi Nishino has worked with notable companies such as Matsushita Electric Industrial Co., Ltd. and Takeda Chemical Industries, Inc. His experience in these organizations has contributed to his expertise in electronic component technology and innovation.
Collaborations
Nishino has collaborated with several talented individuals in his field, including Shinji Kanayama and Naoto Hosotani. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Kenichi Nishino's work in electronic component mounting technology exemplifies the impact of innovation on manufacturing efficiency. His patents and collaborations continue to influence the industry, showcasing the importance of advancements in this field.