Matsushita Electric Industrial Co., Ltd.

Takeda Chemical Industries, Inc.

Toyota Jidosha Kabushiki Kaisha

Panasonic Corporation

Other

Takemoto Yushi Kabushiki Kaisha

Kenichi Nishino

Shinji Kanayama

Shozo Minamitani

Naoto Hosotani

Koichi Morita

Hisayuki Iwai

Syunji Onobori

Kenji Takahashi

Akira Kabeshita

Ken Hatta

Tatsuhiko Ozaki

Nobuya Matsumura

Hiroyuki Kiyomura

Yasuhiro Mishima

Sanzi Aoki

Satoshi Ohnakada

Takahiko Murata

Mitsuo Kinoshita

Hiroyuki Otani

Takashi Shibata

Hiroyuki Yoshida

Kazuto Nishida

Shinjiro Tsuji

Yoshio Kamatani

Kyuya Yamazaki

Shunji Onobori

Michio Tanaka

Hirotaka Wada

Nobuhiko Muraoka

Tomotaka Nishimoto

Kohei Enchi

Hiromu Miyashita

Masayuki Ida

Sanji Aoki

Nobuyuki Nakagawa

Atsuo Kobayashi

Kazuhiro Kimura

Tadao Fukui

Kiyoshi Yasuda

Shinichiro Yamamoto

Sachio Higashi

Naomi Kainou

Hiroshi Maekawa

Yasuhrio Mishima

A heating and pressurizing apparatus (), to which a circuit board () with electronic components () pre-bonded thereto via bonding elements () is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member () having a heating device (). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.

Electronic component, component mounting equipment, and component mounting method

A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.

Bump bonding unit with tray storage and transport apparatuses

A heating and pressurizing apparatus ( ), to which a circuit board ( ) with electronic components ( ) pre-bonded thereto via bonding elements ( ) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member ( ) having a heating device ( ). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

A component mounting apparatus includes a component holding and conveying device for holding and conveying a component and mounting the component onto a circuit board, a circuit board holding device for holding the circuit board, an image recognition optical system for performing recognition of the component and the circuit board with different fields of view, respectively, and a control section. The control section repeatedly determines an optical axis shift amount with the two fields of view between a position of the component and a position of the circuit board recognized by the image recognition optical system. Based on these determination results, the control section determines an optical axis shift amount for calibration, wherein calibration of the image recognition optical system is performed based on the optical-axis shift amount for calibration determined by the control section. Then, the component is mounted onto the circuit board.

Component mounting apparatus and method

IC discarding apparatus for flip chip mounting facility

Method and device for sealing IC chip

A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.

Bonding apparatus for terminal component

A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead. A bonding tool which is used in the method includes a wall having an external lead retaining surface for being set on the flat outer tab and pressing one of the external leads, to bring the one of the external leads into touch with the corresponding one of the electrodes. A laser beam passage is provided in the bonding tool through which a laser beam is irradiated to an external lead bonding part, and a gas passage is also provided, through which cooling gas is jetted on to the external lead bonding part to cool the bonding part of the external lead and the electrode.

Method of bonding an external lead and a tool therefor

Curable unsaturated polyester resin compositions from which molded products with superior surface smoothness can be obtained include a block copolymer of a specified form, an unsaturated polyester, a vinyl monomer, a filler, a curing catalyst and a reinforcing fiber. The block copolymer is of the form A--(B).sub.n where A is non-hydrogenated polyisoprene block having viscosity average molecular weight of 10000 or more, B is saturated polyester block obtainable by condensation of organic dicarboxylic anhydride and 1,2-epoxide, more than 50 mol % of terminal groups of the polyester block being carboxylic acid group, A and B are connected by ester linkage and n is not less than 2. Block copolymers of this type can be formed by starting with carboxylic acid or hydroxyl group in polyisoprene and by alternate condensation of organic dicarboxylic anhydride and 1,2-epoxide.

Curable unsaturated polyester dresin composition

A curable unsaturated polyester resin composition contains graft copolymers each having 10-60 weight % of a first constituent given by ##STR1## 38-89.7 weight % of a second constituent given by ##STR2## and 0.3-2 weight % of a third constituent which is a vinyl monomer unit having carboxylic acid or carboxylic anhydride groups, unsaturated polyester, vinyl monomer, a filler, a curing catalyst, and reinforcing fibers, where either of R.sup.1 and R.sup.2 is H, the other being either H or CH.sub.3, R.sub.3 is ethylene group or propylene group, R.sup.4 is hydrocarbon group with 1-18 carbton atoms, R.sup.5 is alkyl group with 1-4 carbon atoms, R.sup.6 is alkyl group with 1-3 carbon atoms, m is 6-90 and n is 1-5.

Curable unsaturated polyester resin composition

Unsaturated polyester compositions which are quickly curable and from which molded products with superior surface quality can be obtained are characterized as being composed of an unsaturated polyester, an olefinic unsaturated monomer, an aromatic vinyl-conjugated diene block copolymer or a hydrogenated aromatic vinyl-conjugated diene block copolymer, a mixture of t-butylperoxy benzoate, t-butylperoxy octoate and 1,1-bis(t-butylperoxy) 3,3,5-trimethyl cyclohexane, and at least one selected from organic compounds of cobalt, copper and manganese.

Unsaturated polyester compositions and molded products therefrom

An apparatus for compression-molding plastic without producing flashes. The apparartus basically consists of a pair of dies complementary to each other, one being stationary and the other being movable so as to be capable of engaging the stationary one. The apparatus has substantially no clearance at a pinch-off section formed by the engaging edge portions of the two dies, and at least one of the engaging edge portions is made of plastic. In one embodiment of the invention both the engaging edge portions are made of plastic.

Compression molding apparatus

A polyurethane resin composition which comprises (1) a polyurethane prepolymer in the form of liquid or solution, (2) colloidal silica and (3) a siloxane compound having a polyoxyethylene chain in the molecule maintains an excellent thixotropy even after solvents and additives are added and kneaded as the case may be.

Thixotropic polyurethane resin compositions

Growing community of inventors

Osaka, Japan

Kenichi Nishino