The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 1995
Filed:
Jul. 29, 1993
Shinji Kanayama, Kashihara, JP;
Akira Kabeshita, Hirakata, JP;
Kenichi Nishino, Osaka, JP;
Satoshi Ohnakada, Toyonaka, JP;
Takahiko Murata, Kadoma, JP;
Kazuhiro Kimura, Maebashi, JP;
Kazuto Nishida, Katano, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead. A bonding tool which is used in the method includes a wall having an external lead retaining surface for being set on the flat outer tab and pressing one of the external leads, to bring the one of the external leads into touch with the corresponding one of the electrodes. A laser beam passage is provided in the bonding tool through which a laser beam is irradiated to an external lead bonding part, and a gas passage is also provided, through which cooling gas is jetted on to the external lead bonding part to cool the bonding part of the external lead and the electrode.