Toyonaka, Japan

Satoshi Ohnakada


Average Co-Inventor Count = 5.8

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1995-1996

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2 patents (USPTO):Explore Patents

Title: Innovations of Satoshi Ohnakada: Pioneering Bonding Technologies

Introduction

Satoshi Ohnakada, an accomplished inventor based in Toyonaka, Japan, has made significant contributions to the field of bonding technology. With a total of two patents to his name, Ohnakada's work focuses on enhancing methods and apparatus for the bonding of terminal components and external leads.

Latest Patents

Ohnakada's latest patents showcase innovative solutions in bonding technology. The first patent, titled "Bonding Apparatus for Terminal Component," describes an advanced bonding apparatus designed to support a board equipped with terminal components. This apparatus features a vertically movable pressure tool with a heater that applies heat and pressure to bond terminal components to the board effectively. It includes a shockless sheet and a pressing plate made of materials with different thermal expansion coefficients, enhancing the bonding process.

The second patent, "Method of Bonding an External Lead and a Tool Therefor," outlines a method for bonding external leads of integrated circuit (IC) components to circuit substrates. This method involves aligning the external leads with electrodes and using a bonding tool to promote contact and bonding through a combination of laser irradiation and cooling gas application. The innovative design of the bonding tool further improves the bonding process, ensuring efficiency and reliability.

Career Highlights

Throughout his career, Satoshi Ohnakada has worked at Matsushita Electric Industrial Co., Ltd., a company renowned for its focus on electrical and electronic innovations. His dedication to advancing bonding technology has gained him recognition in the industry and solidified his role as a key inventor.

Collaborations

Ohnakada has collaborated with esteemed colleagues, including Shinji Kanayama and Akira Kabeshita. Together, they have contributed to the innovative projects within Matsushita Electric, pushing the boundaries of technology in their field.

Conclusion

Satoshi Ohnakada's contributions to bonding technology, through his patents and collaborative efforts, highlight the importance of innovative thinking in advancing industrial processes. As he continues his work at Matsushita Electric Industrial Co., Ltd., Ohnakada remains a vital figure in the realm of technological innovation.

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