The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 1996
Filed:
Jun. 29, 1995
Shinji Kanayama, Kashihara, JP;
Akira Kabeshita, Hirakata, JP;
Satoshi Ohnakada, Toyonaka, JP;
Kenichi Nishino, Osaka, JP;
Nobuhiko Muraoka, Toyonaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka-fu, JP;
Abstract
A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.