The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2009
Filed:
Sep. 27, 2005
Shozo Minamitani, Hirakata, JP;
Naoto Hosotani, Osaka, JP;
Koichi Morita, Schaumburg, IL (US);
Syunji Onobori, Kyoto, JP;
Kenichi Nishino, Osaka, JP;
Shozo Minamitani, Hirakata, JP;
Naoto Hosotani, Osaka, JP;
Koichi Morita, Schaumburg, IL (US);
Syunji Onobori, Kyoto, JP;
Kenichi Nishino, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A heating and pressurizing apparatus (), to which a circuit board () with electronic components () pre-bonded thereto via bonding elements () is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member () having a heating device (). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.