Company Filing History:
5 out of 164,150 
1 out of 14,713 
Years Active: 1997-2009
Title: Keith Raymond Milkove: Innovator in Thin Film Technology
Introduction
Keith Raymond Milkove is a notable inventor based in Beacon, NY (US). He has made significant contributions to the field of thin film technology, holding a total of 5 patents. His work focuses on improving adhesion in thin film structures, which is crucial for various applications in electronics and materials science.
Latest Patents
One of his latest patents is titled "Device and method for improving interface adhesion in thin film structures." This invention involves a device and method that enhances adhesion for thin film layers by applying a diblock copolymer on a surface where adhesion to subsequent layers is required. The diblock copolymer is cured, and pores are formed by treating it with a solvent. The surface is then etched through these pores to create adhesion-promoting features. After removing the diblock copolymer, a layer is deposited on the surface, utilizing these features to enhance adhesion.
Another significant patent is the "Fabrication process for a magnetic tunnel junction device." This method outlines the fabrication of a magnetic tunnel junction (MTJ) device, where a patterned hard mask is oxidized to form a surface oxide. The MTJ stack is etched in alignment with the patterned hard mask, improving etch selectivity between the hard mask and the MTJ stack, which is essential for device performance.
Career Highlights
Throughout his career, Keith has worked with prominent companies such as IBM and Infineon Technologies AG. His experience in these organizations has allowed him to develop and refine his innovative ideas in the field of thin film technology.
Collaborations
Keith has collaborated with notable professionals in his field, including Steven J. Holmes and Charles Thomas Black. These collaborations have contributed to the advancement of his research and inventions.
Conclusion
Keith Raymond Milkove is a distinguished inventor whose work in thin film technology has led to several important patents. His innovative approaches to improving adhesion in thin film structures continue to impact the industry positively.