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For the Inventor, By the Inventor

Boise, ID, United States of America

Keith R Cook

USPTO Granted Patents = 11

 

Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 33(Granted Patents)


Company Filing History:

goldMedal11 out of 37,905 
 
Micron Technology Incorporated
 patents

Years Active: 2003-2018

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11 patents (USPTO):Explore Patents
1. 10128142 - Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures (2018-11-13),
2. 9472518 - Semiconductor structures including carrier wafers and methods of using such semiconductor structures (2016-10-18),
3. 8349699 - Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry (2013-01-08),
4. 8012847 - Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry (2011-09-06),
5. 7939948 - Interconnect structures with bond-pads and methods of forming bump sites on bond-pads (2011-05-10),
6. 7528064 - Interconnect structures with bond-pads and methods of forming bump sites on bond-pads (2009-05-05),
7. 7488664 - Capacitor structure for two-transistor DRAM memory cell and method of forming same (2009-02-10),
8. 7387940 - Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry (2008-06-17),
9. 7282433 - Interconnect structures with bond-pads and methods of forming bump sites on bond-pads (2007-10-16),
10. 6653241 - Methods of forming protective segments of material, and etch stops (2003-11-25),
11. 6620734 - Methods of forming protective segments of material, and etch stops (2003-09-16),

Title: Innovations of Keith R. Cook in Semiconductor Technology

Introduction

Keith R. Cook is a prominent inventor based in Boise, ID, known for his significant contributions to semiconductor technology. With a total of 11 patents to his name, Cook has made remarkable advancements in the field, particularly in the development of semiconductor structures.

Latest Patents

Among his latest patents, Cook has developed semiconductor structures that include carrier wafers and attached device wafers. One of his notable inventions describes a semiconductor structure comprising a carrier wafer and a device wafer. The carrier wafer is designed with trenches that are sized and configured to receive conductive pillars of the device wafer. These two components are fusion bonded together, allowing for back side processing on the device wafer. Furthermore, the device wafer can be released from the carrier wafer through various methods, including mechanical cleaving, thermal cleaving, and mechanical separation. His patents also disclose methods for forming these semiconductor structures, showcasing his innovative approach to enhancing semiconductor technology.

Career Highlights

Cook's career is marked by his role at Micron Technology Incorporated, where he has been instrumental in advancing semiconductor technologies. His work has not only contributed to the company's success but has also positioned him as a leading figure in the industry.

Collaborations

Throughout his career, Cook has collaborated with notable colleagues, including Sanh D. Tang and Mark E. Tuttle. These collaborations have further enriched his work and have led to significant advancements in semiconductor technology.

Conclusion

Keith R. Cook's innovative contributions to semiconductor technology have established him as a key inventor in the field. His patents reflect a deep understanding of semiconductor structures and methods, paving the way for future advancements.

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