Growing community of inventors

Boise, ID, United States of America

Keith R Cook

Average Co-Inventor Count = 2.69

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 33

Keith R CookSanh D Tang (3 patents)Keith R CookMark E Tuttle (3 patents)Keith R CookRobert D Patraw (3 patents)Keith R CookMark E Jost (2 patents)Keith R CookErik R Byers (2 patents)Keith R CookSharon N Farrens (2 patents)Keith R CookM Ceredig Roberts (2 patents)Keith R CookGurtej S Sandhu (1 patent)Keith R CookMartin Ceredig Roberts (1 patent)Keith R CookCeredig Roberts (1 patent)Keith R CookKeith R Cook (11 patents)Sanh D TangSanh D Tang (306 patents)Mark E TuttleMark E Tuttle (275 patents)Robert D PatrawRobert D Patraw (9 patents)Mark E JostMark E Jost (48 patents)Erik R ByersErik R Byers (23 patents)Sharon N FarrensSharon N Farrens (10 patents)M Ceredig RobertsM Ceredig Roberts (4 patents)Gurtej S SandhuGurtej S Sandhu (1,435 patents)Martin Ceredig RobertsMartin Ceredig Roberts (85 patents)Ceredig RobertsCeredig Roberts (36 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (11 from 37,920 patents)


11 patents:

1. 10128142 - Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures

2. 9472518 - Semiconductor structures including carrier wafers and methods of using such semiconductor structures

3. 8349699 - Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry

4. 8012847 - Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry

5. 7939948 - Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

6. 7528064 - Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

7. 7488664 - Capacitor structure for two-transistor DRAM memory cell and method of forming same

8. 7387940 - Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry

9. 7282433 - Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

10. 6653241 - Methods of forming protective segments of material, and etch stops

11. 6620734 - Methods of forming protective segments of material, and etch stops

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
12/10/2025
Loading…