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For the Inventor, By the Inventor

Nagano, Japan

Keiji Yoshizawa

This inventor holds 7 USPTO granted patents. Top assignee: Shinko Electric Industries Co., Ltd.. Active years: 2003-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keiji Yoshizawa. Retrieved from https://idiyas.com/inventor/keiji-yoshizawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 57.1

Average Co-Inventor Count = 1.4

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:

goldMedal7 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents

Years Active: 2003-2018

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7 patents (USPTO):Explore Patents
1. 9899304 - Wiring substrate and semiconductor device (2018-02-20),
2. 9681546 - Wiring substrate and semiconductor device (2017-06-13),
3. 7495745 - Patterning method and computer readable medium therefor (2009-02-24),
4. 7099806 - Sizing processing system and computer program for the same (2006-08-29),
5. 7085417 - Method of efficiently converting-to-array and compressing data in a process for converting mask patterns of a LSI (2006-08-01),
6. 6957176 - Reduction processing method and computer readable storage medium having program stored thereon for causing computer to execute the method (2005-10-18),
7. 6577991 - Recordable method of processing figure (2003-06-10),

Title: The Innovative Contributions of Keiji Yoshizawa

Introduction

Keiji Yoshizawa, an accomplished inventor based in Nagano, Japan, is recognized for his significant contributions to the field of wiring substrates and semiconductor devices. With a total of seven patents to his name, Yoshizawa has made notable advancements that have implications in modern electronics.

Latest Patents

Among his latest patents, Yoshizawa has developed a wiring substrate that features a first wiring layer, a protective insulation layer, and a first through hole designed to partially expose the wiring layer. This innovative design incorporates a recess defined by a curved wall surface, enhancing the overall functionality of the substrate. Additionally, another notable patent involves a complex wiring substrate with multiple insulation layers, where a through electrode connects the wiring layers effectively. This design highlights the intricacy and depth of his innovative capabilities, showcasing advancements in semiconductor device construction.

Career Highlights

Yoshizawa has built a distinguished career at Shinko Electric Industries Co., Ltd., where his work has been pivotal in enhancing the performance and reliability of electronic components. His expertise in this domain has contributed to the company's reputation as a leader in technological advancements within the industry. His efforts are not only limited to product development but also extend to improving existing technologies.

Collaborations

Throughout his career, Keiji Yoshizawa has collaborated with esteemed colleagues such as Kei Imafuji and Hirokazu Yoshino. Their combined efforts in research and development have led to innovative breakthroughs that continue to shape the future of electronics manufacturing. Working closely with his coworkers, Yoshizawa has fostered a collaborative environment conducive to innovation.

Conclusion

In summary, Keiji Yoshizawa stands out as a vital figure in the field of wiring substrates and semiconductor device innovations. His seven patents reflect a commitment to advancing technology, particularly in electronics. As he continues to contribute to Shinko Electric Industries Co., Ltd., Yoshizawa's work has the potential to drive future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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