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Years Active: 2006-2021
Title: Kei Katoh: Innovator in Cutting Apparatus Technology
Introduction
Kei Katoh is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of cutting apparatus technology, holding a total of 4 patents. His innovative designs focus on improving efficiency and precision in cutting processes.
Latest Patents
One of his latest patents is a cutting apparatus that features a cutting dust collection box. This box collects cutting dust while a cutting dust guide plate directs both cutting water and dust to the collection box. Additionally, a cutting dust breaking unit is included to break the dust into smaller pieces, enhancing the overall efficiency of the apparatus. Another patent involves a cutting apparatus equipped with a width measuring unit. This unit measures the width of grooves formed in a wafer by laser grooving and by a cutting blade. It utilizes an imaging camera and an illuminating unit to distinguish between the grooving groove and the cut groove effectively.
Career Highlights
Throughout his career, Kei Katoh has worked with prominent companies such as Renesas Technology Corporation and Hitachi ULSI Systems Co., Ltd. His experience in these organizations has contributed to his expertise in cutting technology.
Collaborations
Kei Katoh has collaborated with notable coworkers, including Shinya Miyazaki and Koudoh Yamauchi. Their combined efforts have led to advancements in the field of cutting apparatus technology.
Conclusion
Kei Katoh's innovative work in cutting apparatus technology has made a significant impact in the industry. His patents reflect a commitment to enhancing cutting processes, showcasing his expertise and dedication to innovation.