Chavannes-pres-Renens, Switzerland

Ke Liu

USPTO Granted Patents = 7 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Chavannes-près-Renens, CH (2019)
  • Chavannes-prés-Renens, CH (2020)
  • Chavannes-pres-Renens, CH (2019 - 2023)

Company Filing History:


Years Active: 2019-2023

where 'Filed Patents' based on already Granted Patents

7 patents (USPTO):

Title: The Innovative Contributions of Ke Liu

Introduction

Ke Liu is a prominent inventor based in Chavannes-pres-Renens, Switzerland. He has made significant contributions to the field of nanotechnology, particularly in the development of methods for creating nanopores in transition metal dichalcogenides. With a total of seven patents to his name, Liu's work is at the forefront of innovation in material science.

Latest Patents

One of Liu's latest patents is titled "Nanopore forming method and uses thereof." This invention relates to a method for making nanopores in thin layers or monolayers of transition metal dichalcogenides. The method enables accurate and controllable formation of pores within those thin layers with sub-nanometer precision. This advancement has the potential to revolutionize various applications in nanotechnology and materials engineering.

Career Highlights

Throughout his career, Ke Liu has worked with esteemed organizations such as École Polytechnique Fédérale de Lausanne and Roche Sequencing Solutions, Inc. His experience in these institutions has allowed him to collaborate with leading experts in the field and contribute to groundbreaking research.

Collaborations

Some of Liu's notable coworkers include Jiandong Feng and Aleksandra Radenovic. Their collaborative efforts have further enhanced the impact of Liu's inventions and research in the scientific community.

Conclusion

Ke Liu's innovative work in nanopore technology exemplifies the importance of research and development in advancing material science. His contributions continue to inspire future innovations in the field.

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