Kanagawa, Japan

Kazuya Ohkawa

USPTO Granted Patents = 8 


Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 17(Granted Patents)


Location History:

  • Tokyo, JP (2000 - 2012)
  • Kanagawa, JP (2019 - 2022)

Company Filing History:


Years Active: 2000-2022

Loading Chart...
Loading Chart...
8 patents (USPTO):Explore Patents

Title: Kazuya Ohkawa: Innovator in Glass Substrate Technology

Introduction

Kazuya Ohkawa is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of glass substrate technology, holding a total of 8 patents. His innovative methods have advanced the production and functionality of glass substrates, particularly in electronic applications.

Latest Patents

Ohkawa's latest patents include a method for producing a glass substrate with a glass sheet, resin layer, and through-glass via. This method involves several steps, including forming a through hole in a glass sheet and applying a resin layer sensitive to light. The process ensures that the resin layer is protected from unwanted exposure during production. Another notable patent describes a method for producing a glass substrate with through glass vias, which allows for the quick formation of conductive portions while preventing damage to existing circuits.

Career Highlights

Throughout his career, Kazuya Ohkawa has worked with notable companies such as Nippon Sheet Glass Company, Limited and Oki Electric Industry Co., Ltd. His experience in these organizations has contributed to his expertise in glass technology and innovation.

Collaborations

Ohkawa has collaborated with several professionals in his field, including Keiji Tsunetomo and Hideki Hashizume. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Kazuya Ohkawa's contributions to glass substrate technology have positioned him as a key figure in the industry. His innovative methods and collaborative efforts continue to influence advancements in electronic applications.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…