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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10727048 B1

PDFFull Text
Date of Patent:
Jul. 28, 2020

Filed:

Jan. 15, 2019

Method for producing glass substrate with through glass vias and glass substrate

Applicant:

Nippon Sheet Glass Company, Limited, Tokyo, JP;

Inventors:

Keiji Tsunetomo, Kanagawa, JP;

Hideki Hashizume, Tokyo, JP;

Kazuya Ohkawa, Kanagawa, JP;

Assignee:

NIPPON SHEET GLASS COMPANY, LIMITED, Tokyo, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Shamim Ahmed

Int. Cl.
CPC ...
H01L 21/02 (2006.01); C03C 15/00 (2006.01); C03C 17/22 (2006.01); H05K 1/03 (2006.01); H01L 23/15 (2006.01); B23K 26/00 (2014.01); C03C 17/30 (2006.01); H01L 21/48 (2006.01); H05K 3/00 (2006.01); B23K 26/50 (2014.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H05K 1/14 (2006.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02422 (2013.01); B23K 26/0006 (2013.01); B23K 26/50 (2015.10); C03C 15/00 (2013.01); C03C 17/30 (2013.01); H01L 21/486 (2013.01); H01L 21/76805 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H05K 1/0306 (2013.01); H05K 3/002 (2013.01); H05K 3/0032 (2013.01); B23K 2101/40 (2018.08); B23K 2103/54 (2018.08); C03C 2218/34 (2013.01); H01L 2924/0002 (2013.01); H05K 1/141 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/107 (2013.01);
Abstract

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate () with a laser beam to form a modified portion; forming a first conductive portion () on a first principal surface of the glass substrate (), the first conductive portion () being positioned in correspondence with the modified portion (); and forming a through hole () in the glass substrate () after formation of the first conductive portion by etching at least the modified portion () using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

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