The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Sep. 29, 2015
Applicant:

Nippon Sheet Glass Company, Limited, Tokyo, JP;

Inventors:

Keiji Tsunetomo, Kanagawa, JP;

Hideki Hashizume, Tokyo, JP;

Kazuya Ohkawa, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H01L 21/48 (2006.01); C03C 15/00 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01); B23K 1/00 (2006.01); B23K 26/00 (2014.01); B32B 17/06 (2006.01); C03C 3/085 (2006.01); C03C 3/087 (2006.01); C03C 3/089 (2006.01); C03C 17/36 (2006.01); C03C 23/00 (2006.01); B23K 26/0622 (2014.01); B23K 26/53 (2014.01); C03C 17/28 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); B23K 103/00 (2006.01); B23K 101/42 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); B23K 1/0016 (2013.01); B23K 26/0006 (2013.01); B23K 26/0622 (2015.10); B23K 26/53 (2015.10); B32B 17/064 (2013.01); C03C 3/085 (2013.01); C03C 3/087 (2013.01); C03C 3/089 (2013.01); C03C 15/00 (2013.01); C03C 17/28 (2013.01); C03C 17/36 (2013.01); C03C 23/0025 (2013.01); H01L 23/49827 (2013.01); H05K 3/0082 (2013.01); H05K 3/426 (2013.01); B23K 2101/42 (2018.08); B23K 2103/42 (2018.08); B23K 2103/54 (2018.08); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0274 (2013.01); H05K 1/0306 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1581 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A method for producing a glass substrate according to the present invention includes the steps of: (I) forming a through hole () in a glass sheet (); (II) forming a resin layer () on a first principal surface of the glass sheet () using a resin composition sensitive to light having a predetermined wavelength λ; (III) photoexposing an area of the resin layer () that covers the through hole () by irradiating the area with light U having the wavelength λand applied from the direction of a second principal surface of the glass sheet (); and (IV) forming a through-resin hole () by removing the area photoexposed in the step (III). The glass sheet () protects the resin layer () from the light U so as to prevent the resin layer () from being photoexposed by beams of the light U that are incident on the second principal surface of the glass sheet () in the step (III).


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