Musashi Murayama, Japan

Kazumasa Sasakura


Average Co-Inventor Count = 2.2

ph-index = 5

Forward Citations = 59(Granted Patents)


Location History:

  • Musashimurayama, JP (1998 - 1999)
  • Tachikawa, JP (2000)
  • Higashiyamato, JP (2002)
  • Tokyo, JP (1993 - 2020)

Company Filing History:


Years Active: 1993-2020

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12 patents (USPTO):Explore Patents

Title: Kazumasa Sasakura: Innovator in Wire-Bonding Technology

Introduction

Kazumasa Sasakura is a prominent inventor based in Musashi Murayama, Japan. He has made significant contributions to the field of wire-bonding technology, holding a total of 12 patents. His innovative work focuses on enhancing the efficiency and reliability of wire-bonding processes.

Latest Patents

Sasakura's latest patents include a discharge examination device, a wire-bonding apparatus, and a discharge examination method. The discharge examination device is designed to examine the discharge of a wire-bonding apparatus that applies a voltage between a torch electrode and a wire. This device features a current detection unit that detects the discharge current flowing through the wire, a timer unit that measures the discharge detection time, and a discharge determination unit that assesses whether the discharge is abnormal based on the detection time. This innovation allows for the effective detection of discharge abnormalities.

Another notable patent is the ball forming device, which is used to form a ball at the tip of a wire by producing discharge between a torch electrode and the wire tip. This device includes a current supply unit that provides a ball-forming current and a current control unit that regulates the current supply. The design ensures that the ball-forming current signal includes a predetermined current value and a triangle wave, which helps suppress the formation of deformed balls.

Career Highlights

Kazumasa Sasakura has worked with notable companies such as Kabushiki Kaisha Shinkawa and Shinkawa Ltd. His experience in these organizations has contributed to his expertise in wire-bonding technology and innovation.

Collaborations

Sasakura has collaborated with esteemed colleagues, including Osamu Nakamura and Yoshimitsu Terakado. Their joint efforts have further advanced the field of wire-bonding technology.

Conclusion

Kazumasa Sasakura's contributions to wire-bonding technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, ensuring advancements in the efficiency and reliability of wire-bonding processes.

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