The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 1998

Filed:

Nov. 22, 1996
Applicant:
Inventors:

Osamu Nakamura, Kokubunji, JP;

Kazumasa Sasakura, Musashimurayama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
228201 ; 228205 ; 2281805 ; 219 5622 ;
Abstract

A method for cleaning a bonding tool of a bonding apparatus includes a step of positioning a tip portion of the bonding tool between a pair of discharge electrodes, which are primarily used for removing a covering that covers a bonding wire, and a step of causing an electrical discharge across the discharge electrodes by applying a high voltage, such as of 3500 V, by connecting the discharge electrodes to positive and negative poles of a discharge power source, respectively. The electrical discharge is performed with the bonding wire kept inside the bonding tool so as not to project out of the bonding tool or after the bonding wire is removed from the bonding tool.


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