The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 1998
Filed:
Dec. 05, 1996
Applicant:
Inventors:
Osamu Nakamura, Kokubunji, JP;
Kazumasa Sasakura, Musashi Murayama, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437-8 ; 437183 ; 437204 ; 2281805 ; 228904 ;
Abstract
To assure that a loop height remains constant even if the wiring distance should vary and no slack is generated in the hypotenuse of the bonded wire: the length of the covered wire required for a next wiring operation is set by a formula which combines a first-order function of a wiring distance, a first-order reciprocal function of the wiring distance and a constant; the covering-film at the corresponding position is removed; and the exposed-core portion of the covered wire from which the covering-film has been removed is bonded to the lead of a lead frame with the loop height fixed even if the wiring distance should change.