Portland, OR, United States of America

Kari Thorkelsson

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2019-2025

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6 patents (USPTO):

Title: Innovations by Kari Thorkelsson

Introduction

Kari Thorkelsson is a prominent inventor based in Portland, Oregon. She has made significant contributions to the field of semiconductor technology, holding a total of six patents. Her work focuses on advanced bonding techniques and material integrity in semiconductor manufacturing.

Latest Patents

One of her latest patents is for low temperature direct copper-copper bonding. This innovation allows for direct bonding at low temperatures by electroplating copper features on a substrate and electroplanarizing them. The process involves forming nanotwinned copper structures, which enhance the bonding quality by reducing roughness and achieving coplanarity among the copper features. Another notable patent addresses lipseal edge exclusion engineering to maintain material integrity at the wafer edge. This method involves sequential electrodeposition of metals to mitigate the pressure effects of lipseals on mask materials, ensuring better protection during the electroplating process.

Career Highlights

Kari Thorkelsson is currently employed at Lam Research Corporation, where she continues to develop innovative solutions in semiconductor technology. Her expertise in electroplating and bonding techniques has positioned her as a key figure in her field.

Collaborations

Throughout her career, Kari has collaborated with notable colleagues, including Bryan L. Buckalew and Steven T. Mayer. These partnerships have contributed to her success and the advancement of technology in her area of expertise.

Conclusion

Kari Thorkelsson's contributions to semiconductor technology through her patents and collaborations highlight her role as an influential inventor. Her work continues to impact the industry positively.

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