This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Disco Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Kai Minamizaki
Introduction
Kai Minamizaki is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing technology. His innovative approach has led to the development of a unique method that enhances the efficiency of wafer processing.
Latest Patents
Minamizaki holds a patent for a wafer processing method. This method involves emitting a laser beam along an annular line that is a predetermined distance inward of the outer circumferential edge of the first wafer. The process creates an annular first modified layer and a first crack extending from this layer, resulting in warping of the first wafer at its outer circumferential region. The method also includes bonding the front surface of the first wafer to a second wafer to form a bonded wafer stack, followed by grinding the rear surface of the first wafer to achieve a desired finish thickness. He has 1 patent to his name.
Career Highlights
Minamizaki is currently employed at Disco Corporation, where he continues to innovate in the field of wafer processing. His work has been instrumental in advancing the technology used in semiconductor manufacturing.
Collaborations
He collaborates with talented coworkers, including Akira Mizutani and Satoshi Kobayashi, who contribute to the innovative environment at Disco Corporation.
Conclusion
Kai Minamizaki's contributions to wafer processing technology exemplify the spirit of innovation. His patent and ongoing work at Disco Corporation highlight his commitment to advancing the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile