The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jan. 08, 2024
Disco Corporation, Tokyo, JP;
Akira Mizutani, Tokyo, JP;
Kai Minamizaki, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer processing method includes bonding a front surface of a first wafer to a second wafer, applying a laser beam along positions on the inner side other than a peripheral edge of the first wafer by a predetermined distance to form an annular first modified layer and a first crack exposed on the front surface side, thereby generating a warpage in a peripheral region of the first wafer, applying a laser beam to the peripheral region to form a plurality of annular second modified layers and a plurality of second cracks exposed on the front surface side, thereby generating a warpage in the peripheral region, and grinding the first wafer from a back surface side to thin the first wafer to a finished thickness. The bonding of the first wafer and the second wafer to each other is canceled by the warpages in the peripheral region.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile