Kai Hung Cheng

Title: Innovations of Kai Hung Cheng

Introduction

Kai Hung Cheng is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on advanced methods and structures that enhance semiconductor manufacturing processes.

Latest Patents

One of his latest patents is titled "Semiconductor Fin Cutting Process and Structures Formed Thereby." This patent describes methods of cutting fins and the structures that are formed as a result. In one embodiment, the structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure consists of an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. Notably, the insulating liner includes a material with a band gap greater than 5 eV.

Career Highlights

Kai Hung Cheng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative work has positioned him as a key figure in advancing semiconductor technologies.

Collaborations

Throughout his career, Cheng has collaborated with notable colleagues, including Chia-Hui Lin and Shih-Wen Huang, who is a woman. These collaborations have further enriched his contributions to the field.

Conclusion

Kai Hung Cheng's innovative work in semiconductor technology and his numerous patents highlight his significant impact on the industry. His contributions continue to shape the future of semiconductor manufacturing processes.