Company Filing History:

6 out of 40,848

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2015-2021

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11018176 - Metal shielding layer in backside illumination image sensor chips and methods for forming the same (2021-05-25),

2. 10879629 - Method of electroplating metal into recessed feature and electroplating layer in recessed feature (2020-12-29),

3. 10749278 - Method of electroplating metal into recessed feature and electroplating layer in recessed feature (2020-08-18),

4. 10276621 - Metal shielding layer in backside illumination image sensor chips and methods for forming the same (2019-04-30),

5. 9620555 - Metal shielding layer in backside illumination image sensor chips and methods for forming the same (2017-04-11),

6. 9224773 - Metal shielding layer in backside illumination image sensor chips and methods for forming the same (2015-12-29),

Title: The Innovative Journey of Jyun-Ru Wu

Introduction: Jyun-Ru Wu, a talented inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Jyun-Ru Wu holds several patents in the areas of electronics and renewable energy, showcasing his commitment to creating sustainable solutions for the future.

Career Highlights: With a background in engineering, Jyun-Ru Wu has worked for leading tech companies, where he honed his skills and developed cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Jyun-Ru Wu has collaborated with top researchers and scientists to bring his ideas to life, fostering a culture of innovation and creativity in the teams he works with.

Conclusion: Jyun-Ru Wu's passion for innovation and his dedication to pushing the boundaries of technology make him a true pioneer in the world of inventions.

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