This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: Huawei Technologies Co., Limited, Stats Chippac Pte. Ltd.. Active years: 2015-2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:


Years Active: 2015-2024
Title: Innovations of Junwei Hu
Introduction
Junwei Hu is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the performance and reliability of electronic devices.
Latest Patents
Junwei Hu's latest patents include a temperature compensation circuit and a phased array apparatus. The temperature compensation circuit is designed to be applied to a signal processing path. It consists of a temperature detection circuit, a temperature conversion circuit, and a passive variable attenuator. The passive variable attenuator is connected in series within the signal processing path. The temperature detection circuit generates a temperature signal and a reference signal, which are then output to the temperature conversion circuit. This circuit generates a control signal based on the temperature signal and the reference signal. The passive variable attenuator adjusts the attenuation value of the processed signal under the control of the control signal.
His second patent involves a method of forming a perforated opening in the bottom substrate of a flip-chip pop assembly to reduce the bleeding of underfill material. This semiconductor device features a flip-chip semiconductor die mounted to a first substrate using multiple first bumps. An opening is formed in the first substrate at the center of the flip-chip semiconductor die placement. A second substrate holds multiple semiconductor dies that are electrically connected with bond wires. An encapsulant covers the semiconductor dies and the second substrate. The second substrate is then mounted to the first substrate with several second bumps. Underfill material is dispensed through the opening in the first substrate, and the dispensing is stopped as it approaches the perimeter of the flip-chip semiconductor die to minimize bleeding.
Career Highlights
Throughout his career, Junwei Hu has worked with prominent companies such as Stats Chippac Pte. Ltd. and Huawei Technologies Co., Limited. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Some of his notable coworkers include JaeHak Yee and Lin Tan. Their collaboration has likely fostered an environment of innovation and creativity in their respective projects.
Conclusion
Junwei Hu's contributions to the field of semiconductor technology through his patents and career experiences highlight his role as an influential inventor. His work continues to impact the development of advanced electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile