The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
May. 17, 2010
Junwei HU, Shanghai, CN;
Jaehak Yee, Qinpu District, CN;
Lin Tan, Shanghai, CN;
Wenbin Qu, Shanghai, CN;
Yufeng Feng, Shanghai, CN;
Junwei Hu, Shanghai, CN;
JaeHak Yee, Qinpu District, CN;
Lin Tan, Shanghai, CN;
Wenbin Qu, Shanghai, CN;
YuFeng Feng, Shanghai, CN;
STATS ChipPAC, Ltd., Singapore, SG;
Abstract
A semiconductor device has a flipchip semiconductor die mounted to a first substrate using a plurality of first bumps. An opening or plurality of openings is formed in the first substrate in a location central to placement of the flipchip semiconductor die to the first substrate. A plurality of semiconductor die is mounted to a second substrate. The semiconductor die are electrically connected with bond wires. An encapsulant is over the plurality of semiconductor die and second substrate. The second substrate is mounted to the first substrate with a plurality of second bumps. An underfill material is dispensed through the opening in the first substrate between the flipchip semiconductor die and first substrate. The dispensing of the underfill material is discontinued as the underfill material approaches or reaches a perimeter of the flipchip semiconductor die to reduce bleeding of the underfill material. The underfill material is cured.