Huawei Technologies Co., Limited

Stats Chippac Pte. Ltd.

Junwei Hu

JaeHak Yee

Rong Peng

Wenbin Qu

Lin Tan

YuFeng Feng

Example temperature compensation circuits and a phased array apparatus are described. One example temperature compensation circuit is applied to a signal processing path. The example temperature compensation circuit includes a temperature detection circuit, a temperature conversion circuit, and a passive variable attenuator. The passive variable attenuator is configured to be connected in series in the signal processing path. The temperature detection circuit is configured to generate a temperature signal and a reference signal, and output the temperature signal and the reference signal to the temperature conversion circuit. The temperature signal monotonically changes with a temperature of the signal processing path. The temperature conversion circuit is configured to generate a control signal based on the temperature signal and the reference signal. The passive variable attenuator is configured to adjust, under control of the control signal, an attenuation value of a signal processed by the signal processing path.

Temperature compensation circuit and phased array apparatus

A semiconductor device has a flipchip semiconductor die mounted to a first substrate using a plurality of first bumps. An opening or plurality of openings is formed in the first substrate in a location central to placement of the flipchip semiconductor die to the first substrate. A plurality of semiconductor die is mounted to a second substrate. The semiconductor die are electrically connected with bond wires. An encapsulant is over the plurality of semiconductor die and second substrate. The second substrate is mounted to the first substrate with a plurality of second bumps. An underfill material is dispensed through the opening in the first substrate between the flipchip semiconductor die and first substrate. The dispensing of the underfill material is discontinued as the underfill material approaches or reaches a perimeter of the flipchip semiconductor die to reduce bleeding of the underfill material. The underfill material is cured.

Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material

Growing community of inventors

Shanghai, China

Junwei Hu