Yokkaichi, Japan

Junpei Kanazawa


Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 89(Granted Patents)


Company Filing History:


Years Active: 2019-2022

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7 patents (USPTO):Explore Patents

Title: Junpei Kanazawa: Innovator in Three-Dimensional Memory Devices

Introduction

Junpei Kanazawa is a prominent inventor based in Yokkaichi, Japan. He has made significant contributions to the field of memory devices, holding a total of 7 patents. His innovative work focuses on enhancing the performance and structural integrity of three-dimensional memory devices.

Latest Patents

Kanazawa's latest patents include groundbreaking technologies such as a three-dimensional memory device that incorporates through-memory-level via structures and methods for their fabrication. This invention features an alternating stack of insulating and electrically conductive layers over a semiconductor material layer. Memory stack structures extend vertically through this stack, while a vertical arrangement of dielectric plates interlaces with the insulating layers. The conductive via structures provide essential connections to underlying metal interconnects, enhancing the device's functionality. Another notable patent involves a three-dimensional memory device with multi-tier moat isolation structures, which improves the manufacturing process and structural support of the device.

Career Highlights

Kanazawa's career is marked by his role at Sandisk Technologies Inc., where he has been instrumental in developing advanced memory technologies. His expertise in three-dimensional memory devices has positioned him as a key player in the industry.

Collaborations

Throughout his career, Kanazawa has collaborated with talented individuals such as Yoshitaka Otsu and Koichiro Nagata. These partnerships have fostered innovation and contributed to the success of their projects.

Conclusion

Junpei Kanazawa's contributions to the field of memory devices exemplify his dedication to innovation and technology. His patents reflect a commitment to advancing the capabilities of three-dimensional memory systems.

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