Shenzhen, China

Junlei Tao

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: Huawei Technologies Co., Limited, Huawei Technologies Co., Ltd.. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junlei Tao. Retrieved from https://idiyas.com/inventor/junlei-tao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 5.8

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022-2026

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2 patents (USPTO):Explore Patents

Title: Junlei Tao: Innovator in Chip Packaging Technology

Introduction

Junlei Tao is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of chip packaging technology. With a total of 2 patents to his name, his work focuses on enhancing the efficiency and functionality of packaged chips.

Latest Patents

Junlei Tao's latest patents include a "Package chip having a heat sink and method for manufacturing package chip." This innovation provides a packaged chip that consists of a substrate, a chip, and a heat sink. The heat sink is designed with a first bracket, a second bracket, and a cover, ensuring effective thermal management. The first bracket is a sealed annular bracket that encircles a first space where the chip is accommodated. A thermal interface material is placed between the chip and the cover, and a filling material is used to enhance the structure.

Another notable patent is for "Encapsulation of a substrate electrically connected to a plurality of pin arrays." This invention involves a chip and its packaging method, where first solder pads on a substrate are attached to corresponding pins on different dies. This design allows for short-distance and high-density interconnection among the dies, utilizing a molding body to create an integral structure.

Career Highlights

Junlei Tao has worked with leading companies in the technology sector, including Huawei Technologies Co., Ltd. and Huawei Technologies Co., Limited. His experience in these organizations has contributed to his expertise in chip packaging and semiconductor technologies.

Collaborations

Throughout his career, Junlei has collaborated with notable professionals in the field, including Shanghsuan Chiang and Nan Zhao. These collaborations have further enriched his work and innovations in chip technology.

Conclusion

Junlei Tao is a distinguished inventor whose contributions to chip packaging technology have made a significant impact in the industry. His innovative patents reflect his commitment to advancing technology and improving product performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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