The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Sep. 29, 2021
Huawei Technologies Co., Ltd., Shenzhen, CN;
Jiantao Zheng, Shenzhen, CN;
Nan Zhao, Shenzhen, CN;
Shanghsuan Chiang, Shenzhen, CN;
Xiao Hu, Shenzhen, CN;
Junlei Tao, Shenzhen, CN;
Yu Jiang, Beijing, CN;
Jianbiao Lu, Shenzhen, CN;
Huawei Technologies Co., Ltd., Shenzhen, CN;
Abstract
A packaged chip and a method for manufacturing the packaged chip are provided. The packaged chip includes a substrate, a chip, and a heat sink. The heat sink includes a first bracket, a second bracket, and a cover. The first bracket and the second bracket are disposed on the substrate. The cover is supported on the substrate by the first bracket and the second bracket. The first bracket is a sealed annular bracket. The first bracket and the cover encircle a first space. The chip is accommodated in the first space. A thermal interface material is disposed between the chip and the cover. A hole connected to the first space is provided on the cover. The hole and the first space are filled with a filling material. The second bracket is located outside the first space.