Nan Zhao

Title: The Innovative Contributions of Nan Zhao

Introduction

Nan Zhao is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of electronics, particularly in chip packaging technologies. With a total of 17 patents to his name, Zhao has established himself as a key figure in the industry.

Latest Patents

Zhao's latest patents include innovative designs such as a chip package, an electronic device, and a chip package preparation method. The chip package features a substrate, a first die, a second die, and a beam structure. The first and second dies are positioned on one side of the substrate and are electrically connected to it. The beam structure is strategically placed between the two dies, with one end fixed to the first die and the other to the second die. Notably, the thermal expansion coefficient of the beam structure is less than that of the substrate, enhancing the package's reliability. Another patent focuses on encapsulating a substrate that is electrically connected to multiple pin arrays. This design allows for short-distance and high-density interconnections between different dies, utilizing a molding body to create an integral structure.

Career Highlights

Throughout his career, Nan Zhao has worked with leading technology companies, including ZTE Corporation and Huawei Technologies Co., Limited. His experience in these organizations has contributed to his expertise in electronic device innovation and chip packaging.

Collaborations

Zhao has collaborated with notable colleagues in the field, including Feng Li and Kaibo Tian. Their joint efforts have further advanced the development of cutting-edge technologies in electronics.

Conclusion

Nan Zhao's contributions to the field of electronics, particularly in chip packaging, have been substantial. His innovative patents and collaborations with industry leaders highlight his role as a significant inventor in the technology sector.