Suwon-si, South Korea

Jungsuk Goh

USPTO Granted Patents = 2 

Average Co-Inventor Count = 11.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Suwon-si, KR (2023)
  • Hwaseong-si, KR (2024)

Company Filing History:


Years Active: 2023-2024

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2 patents (USPTO):Explore Patents

Title: Innovations by Inventor Jungsuk Goh

Introduction

Jungsuk Goh is a notable inventor based in Suwon-si, South Korea. With a total of two patents to his name, he has contributed significantly to his field through innovative solutions and advanced technology.

Latest Patents

His latest patents include a "Method and apparatus for treating substrate" and "Die bonding apparatus and method and substrate bonding apparatus and method." The first patent provides a method for treating a substrate by utilizing two fluids in a supercritical state with differing densities to efficiently eliminate residue. This inventive approach aims to optimize substrate treatment processes. The second patent details a novel technique for bonding dies to substrates without the need for additional bonding mediums like adhesion films or solder bumps. This method involves hydrophilizing the bonding surface of the die through plasma processing, forming a liquid film on the substrate, and allowing for simultaneous bonding through heat treatment.

Career Highlights

Jungsuk Goh works for Semes Co., Ltd., where he applies his expertise in developing cutting-edge technologies in substrate treatment and bonding methods. His work is crucial in advancing manufacturing processes that require precise and efficient bonding techniques.

Collaborations

Throughout his career, Goh has collaborated with talented individuals, including coworkers Doyeon Kim and Choonghyun Lee. Together, they contribute to innovation in their sector, showcasing a strong team dynamic focused on research and development.

Conclusion

Jungsuk Goh's contributions through his patents reflect his dedication to innovation within the technology landscape. His work at Semes Co., Ltd. demonstrates his commitment to advancing industry practices and fostering collaborative efforts that drive progress in substrate treatment and bonding methodologies.

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