Semes Co., Ltd.

Jungsuk Goh

Doyeon Kim

Choonghyun Lee

Pil Kyun Heo

Jaeseong Lee

Hyun Yoon

Jihoon Park

Do Heon Kim

Yong-Jun Seo

Minyoung Kim

Youngje Um

Kwangsup Kim

Yerim Yeon

Byeong Geun Kim

Soo Ill Jang

Yoonki Sa

Dongok Ahn

Hanglim Lee

Hyo Seok Lee

Yungi Kim

The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

Method and apparatus for treating substrate

Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.

Die bonding apparatus and method and substrate bonding apparatus and method

Growing community of inventors

Suwon-si, South Korea

Jungsuk Goh