The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Oct. 21, 2019
Semes Co., Ltd., Chungcheongnam-do, KR;
Hanglim Lee, Cheonan-si, KR;
Jungsuk Goh, Suwon-si, KR;
Kwangsup Kim, Asan-si, KR;
Doyeon Kim, Yongin-si, KR;
Minyoung Kim, Hwaseong-si, KR;
Jihoon Park, Seoul, KR;
Yungi Kim, Yongin-si, KR;
Do Heon Kim, Cheonan-si, KR;
Choonghyun Lee, Hwaseong-si, KR;
Hyo Seok Lee, Gunpo-si, KR;
Soo Ill Jang, Asan-si, KR;
SEMES CO., LTD., Chungcheongnam-Do, KR;
Abstract
Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.