Soo Ill Jang

Title: The Innovative Journey of Soo Ill Jang

Introduction

Soo Ill Jang, an accomplished inventor based in Asan-si, South Korea, has made significant strides in the field of semiconductor technology with his contributions to die bonding and substrate bonding methods. With a total of two patents to his name, his work focuses on innovative processes that enhance the efficiency and effectiveness of bonding techniques used in electronics manufacturing.

Latest Patents

Soo Ill Jang's recent patents include a Die Bonding Apparatus and Method, as well as a Substrate Bonding Apparatus and Method. These inventions address the need for more effective bonding solutions that do not rely on traditional bonding mediums such as adhesion films and solder bumps. The die bonding method he developed utilizes plasma processing to hydrophilize the bonding surface of the die and forms a liquid film on the substrate at the bonding area by supplying water. This process allows for pre-bonding of the die to the substrate and simultaneous post-bonding of multiple dies through heat treatment, significantly streamlining the assembly process.

Additionally, his apparatus for treating substrates includes a container with an open treatment space, a rotatable support unit, a heating unit, and a fluid supply unit. The innovative design features multiple heaters across different zones, controlled by a dynamic system that adapts the heating process based on real-time temperature readings, ensuring optimal treatment of the substrate.

Career Highlights

Soo Ill Jang is affiliated with Semes Co., Ltd., a prominent player in the semiconductor equipment industry. His career has been marked by a dedication to advancing semiconductor technologies, with his inventions reflecting a deep understanding of the industry's challenges and requirements. The innovative bonding methods he has created not only enhance the reliability of electronic components but also improve manufacturing efficiency.

Collaborations

Throughout his career, Soo Ill Jang has collaborated with esteemed coworkers such as Hanglim Lee and Jungsuk Goh. These partnerships have been instrumental in refining his inventions, leading to patents that contribute meaningfully to the field of semiconductor bonding technology.

Conclusion

Soo Ill Jang continues to be an influential figure in the realm of innovations in semiconductor technology. His latest patents highlight a commitment to developing methods that simplify processes and enhance product reliability. As technology continues to evolve, the contributions of inventors like Soo Ill Jang will undoubtedly play a crucial role in shaping the future of electronics manufacturing.