Semes Co., Ltd.

Soo Ill Jang

Jihoon Park

Do Heon Kim

Minyoung Kim

Kwangsup Kim

Doyeon Kim

Choonghyun Lee

Hanglim Lee

Jungsuk Goh

Yungi Kim

Hyo Seok Lee

Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.

Die bonding apparatus and method and substrate bonding apparatus and method

The inventive concepts relate to an apparatus for treating a substrate. The apparatus includes a container having a treatment space of which a top end is opened, a rotatable support unit supporting a substrate disposed within the treatment space, a heating unit heating the substrate supported by the support unit, and a fluid supply unit supplying a fluid to the substrate disposed on the support unit. The heating unit includes a plurality of heaters installed in a plurality of zones of the support unit, respectively, and a controller controlling the plurality of heaters. The controller controls the plurality of heaters by a first mode until the plurality of zones reach a target temperature, and the controller controls the plurality of heaters by a second mode different from the first mode after the plurality of zones reach the target temperature.

Apparatus and method for treating substrate

Growing community of inventors

Asan-si, South Korea

Soo Ill Jang