Osaka, Japan

Jun Shirakami

USPTO Granted Patents = 13 


Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 23(Granted Patents)


Location History:

  • Osaka, JP (1994 - 2018)
  • Takaishi, JP (2017 - 2022)

Company Filing History:


Years Active: 1994-2022

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13 patents (USPTO):Explore Patents

Title: Jun Shirakami: Innovator in Electronic Component Packaging

Introduction

Jun Shirakami is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of electronic component packaging, holding a total of 13 patents. His innovative work focuses on enhancing the functionality and reliability of electronic components through advanced packaging techniques.

Latest Patents

One of Jun Shirakami's latest patents is an electronic component package that includes stacked shield layers and a method for producing the same. This invention provides an electronic component mounted on a circuit board with a ground pattern, encapsulated in a mold containing epoxy resin. The shield layer, formed by stacking a metal particle layer, a copper plating layer, and a nickel plating layer, is grounded to the ground pattern, ensuring excellent adhesion. Another notable patent involves a method for forming an electrically conductive ultrafine pattern, which utilizes a composite technique of printing and plating processes. This method results in a highly accurate electric circuit, showcasing Jun's expertise in creating advanced electronic solutions.

Career Highlights

Throughout his career, Jun Shirakami has worked with notable companies such as Dic Corporation and Dainippon Ink and Chemicals, Incorporated. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in electronic component technology.

Collaborations

Jun has collaborated with talented individuals in his field, including Yukie Saitou and Wataru Fujikawa. These partnerships have fostered a creative environment that has led to the development of innovative solutions in electronic packaging.

Conclusion

Jun Shirakami's contributions to the field of electronic component packaging are noteworthy. His patents reflect a commitment to innovation and excellence, making him a significant figure in the industry. His work continues to influence the development of advanced electronic technologies.

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