The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Feb. 21, 2019
Dic Corporation, Tokyo, JP;
Jun Shirakami, Takaishi, JP;
Norimasa Fukazawa, Takaishi, JP;
DIC CORPORATION, Tokyo, JP;
Abstract
The present invention provides an electronic component package including an electronic component mounted on a circuit board having a ground pattern, a mold containing an epoxy resin that encapsulates the electronic component, and a shield layer formed on the mold. The shield layer is formed by stacking a metal particle layer, a copper plating layer, and a nickel plating layer in this order from the mold side, and the shield layer is grounded to the ground pattern. The present invention also provides a method for manufacturing the electronic component package. The electronic component package is excellent in the adhesion of the shield layer.