The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Jan. 16, 2014
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Wataru Fujikawa, Osaka, JP;

Jun Shirakami, Osaka, JP;

Akira Murakawa, Osaka, JP;

Yukie Saitou, Osaka, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); C09D 11/102 (2014.01); B41J 2/01 (2006.01); C09D 11/52 (2014.01); B41M 5/52 (2006.01); H05K 3/12 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
C09D 11/102 (2013.01); B41J 2/01 (2013.01); B41M 5/5263 (2013.01); C09D 11/52 (2013.01); H05K 1/092 (2013.01); H05K 3/125 (2013.01); H05K 3/1208 (2013.01); H05K 3/182 (2013.01); B32B 2307/202 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/75 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/20 (2013.01); H05K 2203/0709 (2013.01);
Abstract

The present invention provides an absorbing-layer-forming composition including a blocked isocyanate such that the amount of the blocked isocyanate is 50% by mass to 100% by mass of the solid content of the absorbing-layer-forming composition and an absorbing substrate, a printed item, and a conductive pattern that are formed using the absorbing-layer-forming composition. The absorbing-layer-forming composition according to the present invention can be used for forming an absorbing layer which is capable of carrying a fluid such as an ink therein and which enables good adhesion between various types of supports and a conductive layer to be achieved. In particular, using a blocked isocyanate having a number-average molecular weight of 1,000 to 5,000 further increases the adhesion between various types of supports and the conductive layer.


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