The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Jan. 21, 2014
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Akira Murakawa, Osaka, JP;

Jun Shirakami, Osaka, JP;

Wataru Fujikawa, Osaka, JP;

Yukie Saitou, Osaka, JP;

Assignee:

DIC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01); H05K 3/24 (2006.01); H05K 3/38 (2006.01); C09D 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); C09D 5/00 (2013.01); H05K 3/246 (2013.01); H05K 3/386 (2013.01); H05K 3/4664 (2013.01); H05K 1/0393 (2013.01); Y10T 428/12549 (2015.01);
Abstract

The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.


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