Dic Corporation

Dainippon Ink and Chemicals, Incorporated

Toray Industries, Inc.

Dic Corporation (Tokyo)

Jun Shirakami

Kazunori Tanaka

Wataru Fujikawa

Yukie Saitou

Akira Murakawa

Masayuki Kamei

Yutaka Hashimoto

Yoshinori Katayama

Sadamu Nagahama

Sunao Yoshihara

Norimasa Fukazawa

Ryuichi Matsuoka

Shoshiro Taneichi

Hiroshi Matsuzawa

Haruhiko Katsuta

Hiroyoshi Kannari

Junichi Miyake

Makoto Ichinose

Yutaki Hashimoto

The present invention provides an electronic component package including an electronic component mounted on a circuit board having a ground pattern, a mold containing an epoxy resin that encapsulates the electronic component, and a shield layer formed on the mold. The shield layer is formed by stacking a metal particle layer, a copper plating layer, and a nickel plating layer in this order from the mold side, and the shield layer is grounded to the ground pattern. The present invention also provides a method for manufacturing the electronic component package. The electronic component package is excellent in the adhesion of the shield layer.

Electronic component package including stacked shield layers and method for producing same

There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit

The present invention provides a urethane resin composition containing a urethane resin having polymerizable unsaturated groups and an aqueous medium. The urethane resin is obtained by reacting a polyol with a polyisocyanate. The polyol contains an alkylenediol having two or more polymerizable unsaturated groups or an oxyalkylenediol having two or more polymerizable unsaturated groups. The alkylenediol is represented by general formula (1):HO&#x2014;R&#x2014;OH&#x2003;&#x2003;(1)(where Ris a linear alkylene group of one to nine carbon atoms having two or more atomic groups containing a polymerizable unsaturated group in side chains thereof). The oxyalkylenediol (a1-2) is represented by general formula (2):HO&#x2014;RO&#x2014;R&#x2014;OR&#x2014;OH&#x2003;&#x2003;(2)(where Rand Rare ethylene groups having a total of two or more atomic groups containing a polymerizable unsaturated group in side chains thereof, and Ris an alkylene group of one to five carbon atoms). This urethane resin composition can form a coating with good elongation and flexibility and high hardness.

Urethane resin composition, coating agent, and article

The present invention provides an aqueous coating agent including a vinyl polymer (A) having a basic nitrogen atom-containing group and a carboxylic group, a quaternary ammonium salt (B), and an aqueous medium (C). Particularly, the present invention provides an aqueous coating agent including a compound represented by General Formula (1) below as the quaternary ammonium salt (B). The aqueous coating agent has excellent adhesiveness, warm water resistance, corrosion resistance, and chemical resistance, and can form a film that is capable of preventing the deterioration of various substrates. In General Formula (1), Rto Reach independently represent an alkyl group having 1 to 20 carbon atoms or an aryl group.

Aqueous coating agent and article using same

The present invention provides an absorbing-layer-forming composition including a blocked isocyanate such that the amount of the blocked isocyanate is 50% by mass to 100% by mass of the solid content of the absorbing-layer-forming composition and an absorbing substrate, a printed item, and a conductive pattern that are formed using the absorbing-layer-forming composition. The absorbing-layer-forming composition according to the present invention can be used for forming an absorbing layer which is capable of carrying a fluid such as an ink therein and which enables good adhesion between various types of supports and a conductive layer to be achieved. In particular, using a blocked isocyanate having a number-average molecular weight of 1,000 to 5,000 further increases the adhesion between various types of supports and the conductive layer.

Absorbing-layer-forming composition and absorbing substrate, printed item, conductive pattern, and electric circuit produced using the same

Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.

Method for forming high-definition metal pattern, high-definition metal pattern, and electronic component

Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Laminate, conductive pattern, and method for producing laminate

The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Laminate, conductive pattern, electrical circuit, and method for producing laminate

Disclosed is a coating agent characterized by comprising: a core-shell-type resin particles (A) each having a shell layer and a core layer; a compound (B) having at least one selected from the group consisting of a hydrolysable silyl group and a silanol group and also having an epoxy group; and an aqueous medium, wherein the shell layer comprises (a1) a urethane resin with 2000 to 5500 mmol/kg of an aliphatic cyclic structure and at least one selected from the group consisting of a carboxyl group and a carboxylate group and the core layer comprises (a2) a vinyl polymer having a basic nitrogen-atom-containing group. Further disclosed are a coating agent for a plastic base material and a coating agent for a metallic base material.

Coating agent and method for production thereof

An object to be achieved by the present invention is to provide a resin composition for forming a receiving layer, the resin composition being capable of forming, among receiving layers that can carry a fluid such as an ink, a receiving layer having excellent, adhesion to various types of supports and capable of forming a receiving layer which has excellent printing properties without causing bleeding of a fluid such as an ink. The present invention relates to a resin composition for forming a receiving layer, the resin composition containing a urethane resin (A), a vinyl polymer (B), and an aqueous medium (C), in which the urethane resin (A) has an alicyclic structure in an amount of 2,000 to 5,500 mmol/kg relative to the total amount of the urethane resin (A), and a hydrophilic group.

Resin composition for forming receiving layer, and receiving substrate; printed matter, conductive pattern, and electric circuit produced by using the resin composition

A curing composition comprising (1) a fluorine-containing curing monomer containing a fluorinated alkyl group having not less than 6 carbon atoms, (2) a fluorine-containing curing monomer containing a fluorinated alkyl group having not more than 5 carbon atoms, and (3) a polyfunctional curing monomer, the weight ratio of said fluorine-containing curing monomer (1) to said fluorine-containing curing monomer (2) ranging from 75/25 to 99/1. The composition is coated on an optical fiber base and cured by active energy rays to provide a core/clad optical fiber excellent in transparency, mechanical strength, environmental resistance, and optical characteristics.

Optical fiber coating composition and method of preparing a cured coating composition

The present invention provides a curable composition for use in optical fiber cladding comprising 48.8.about.92.9 wt % of 2-(perfluorooctyl) ethyl acrylate (I), 1.3.about.23.8 wt % of 2,2,3,3-tetrafluoroproprylacrylate (II), 5.0.about.30.0 wt % of trimethylolpropane triacrylate (III), and 0.1.about.5.0 wt % of photopolymerization initiator (IV), wherein the weight ratio [(I)/(II)] of monomer (I) and monomer (II) is within a range of from 75/25 to 98/2, and an optical fiber having cladding formed by the hardening of this curable composition and a core comprising quartz.

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Osaka, Japan

Jun Shirakami