Hefei, China

Jun He

USPTO Granted Patents = 38 

 

Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 27(Granted Patents)


Location History:

  • Ningguo, CN (2023)
  • Anhui, CN (2021 - 2024)
  • Hefei, CN (2022 - 2024)

Company Filing History:


Years Active: 2021-2025

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38 patents (USPTO):Explore Patents

Title: Innovations and Patents of Jun He

Introduction: Jun He, located in Hefei, China, is a prolific inventor with an impressive portfolio of 33 patents. His contributions to the fields of tuning circuits and injection molding demonstrate his commitment to advancing technology.

Latest Patents: Among Jun He's latest innovations are two notable patents: a tuning circuit and communication device, as well as an injection mold and injection molding method. The tuning circuit patent outlines a sophisticated design that includes a tuning switch, ground patch point, and multiple sets of patch units. This innovative design enables better signal management by connecting patch points to different contact points of an antenna and ensuring ground connections. The injection mold patent focuses on improving the reliability of package chips by utilizing a base plate designed for efficient glue injection, which enhances the integrity of the substrate and the chip fixed on it.

Career Highlights: Jun He has achieved remarkable recognition for his work in the tech industry. He has been associated with esteemed organizations such as Changxin Memory Technologies, Inc. and Anhui University, where he has contributed to significant research and development projects. His expertise in the field of engineering has played a crucial role in driving forward innovative solutions.

Collaborations: Throughout his career, Jun He has worked alongside talented colleagues, including Zhan Ying and Jie Liu. Their combined efforts have led to groundbreaking advancements in technology, particularly in the areas of memory technologies and integrated circuits.

Conclusion: Jun He's dedication to innovation is evident in his considerable number of patents and his impactful collaborations. As he continues to develop new technologies, his contributions will likely shape the future of communication devices and manufacturing processes. The landscape of electronics and engineering stands to benefit greatly from his ongoing work.

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