The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Jun. 20, 2022
Applicant:
Changxin Memory Technologies, Inc., Hefei, CN;
Inventors:
Assignee:
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49822 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 25/0652 (2013.01); H01L 23/481 (2013.01); H01L 24/09 (2013.01); H01L 24/13 (2013.01); H01L 24/80 (2013.01); H01L 24/81 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08148 (2013.01); H01L 2224/0913 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01);
Abstract
A chip package structure and a storage system are provided. The chip package structure includes a chipset, a first Re-Distribution Layer (RDL), and a bonding pad region. The chipset includes a plurality of chips distributed horizontally. The first RDL is disposed on a first surface of the chipset. The bonding pad region includes a plurality of bonding pads, the plurality of bonding pads are located on a side surface of the first RDL away from the chipset, and the plurality of bonding pads are connected to the plurality of chips through the first RDL.