The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Sep. 13, 2021
Applicant:
Changxin Memory Technologies, Inc., Hefei, CN;
Inventors:
Assignee:
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); B29C 45/27 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/27 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); B29L 2031/34 (2013.01);
Abstract
An injection mould and an injection moulding method are provided. The injection mould includes: a base plate, configured to place a package chip to be injection-moulded, the package chip including a substrate and at least one chip fixed on a surface of the substrate by a flip chip process, the substrate having a through hole, a glue injection channel being formed in the base plate and configured to inject a moulding compound, and the glue injection channel being connected with the through hole on the substrate. The above-mentioned injection mould can improve the reliability of the package chip after injection moulding.