Kaohsiung, Taiwan

Jun-Cheng Liu

This inventor holds 3 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2008-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jun-Cheng Liu. Retrieved from https://idiyas.com/inventor/jun-cheng-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Kaoshiung, TW (2008)
  • Kaohsiung, TW (2010 - 2014)

Company Filing History:


Years Active: 2008-2014

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3 patents (USPTO):Explore Patents

Title: Innovations of Jun-Cheng Liu in Semiconductor Technology

Introduction

Jun-Cheng Liu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the efficiency and functionality of heatsinks and related systems.

Latest Patents

One of Jun-Cheng Liu's latest patents is the "Heatsink and heatsink-positioning system." This invention includes a heatsink and a positioning device designed to enhance the stability of the heatsink. The heatsink features a circular top, a ring-shaped sidewall, and multiple foot portions. The ring-shaped sidewall connects to the circular top and extends away from it, incorporating at least one first positioning portion for fixing the heatsink. The foot portions, which connect to the ring-shaped sidewall, each have an opening. The positioning device includes at least one second positioning portion that corresponds to the first, ensuring the heatsink remains securely in place. This innovation addresses the common issue of heatsink displacement.

Another significant patent is the "Heat slug for package structure." This invention provides a heat slug designed for a package structure, consisting of a main body and several protrusions. The main body features a surface with at least one defined ditch, while each protrusion extends from the main body and has a surface with multiple dimples. This design enhances the thermal management capabilities of the package structure.

Career Highlights

Jun-Cheng Liu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor field. His work has been instrumental in developing advanced thermal management solutions that are crucial for modern electronic devices.

Collaborations

Throughout his career, Jun-Cheng Liu has collaborated with talented individuals such as Cheng-Cheng Liu and Chi-Ming Chen. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Jun-Cheng Liu's contributions to semiconductor technology through his innovative patents demonstrate his commitment to enhancing thermal management solutions. His work not only addresses existing challenges but also paves the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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