The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2010
Filed:
Aug. 07, 2007
Applicants:
Cheng-cheng Liu, Kaohsiung, TW;
Jun-cheng Liu, Kaohsiung, TW;
Hsin-hao Chen, Kaohsiung, TW;
Chi-ming Chen, Kaohsiung, TW;
Inventors:
Cheng-cheng Liu, Kaohsiung, TW;
Jun-cheng Liu, Kaohsiung, TW;
Hsin-hao Chen, Kaohsiung, TW;
Chi-ming Chen, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat slug is provided for a package structure, including a main body and a plurality of protrusions. The main body has a surface in which at least one ditch is defined. Each protrusion is connected to and extends from the main body and has a surface in which a plurality of dimples is defined.
Liu, Cheng-cheng. (2010). Heat slug for package structure (U.S. Patent No. 7763959). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7763959
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile