Kaohsiung, Taiwan

Cheng-Cheng Liu

This inventor holds 3 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2006-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Cheng Liu. Retrieved from https://idiyas.com/inventor/cheng-cheng-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.7

ph-index = 2

Forward Citations = 42(Granted Patents)


Location History:

  • Douliou, TW (2006)
  • Kaohsiung, TW (2010 - 2014)

Company Filing History:


Years Active: 2006-2014

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3 patents (USPTO):Explore Patents

Title: Innovations by Cheng-Cheng Liu

Introduction

Cheng-Cheng Liu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor engineering, particularly through his innovative designs and patents. With a total of 3 patents to his name, Liu continues to push the boundaries of technology.

Latest Patents

One of Liu's latest patents is the "Heatsink and heatsink-positioning system." This invention includes a heatsink and a positioning device designed to improve the stability of the heatsink. The heatsink features a circular top, a ring-shaped sidewall, and multiple foot portions. The ring-shaped sidewall connects to the circular top and extends away from it, incorporating at least one first positioning portion for fixing the heatsink. Each foot portion has an opening, and the positioning device includes at least one second positioning portion that corresponds to the first, ensuring the heatsink remains securely in place. This innovative system addresses the common issue of heatsink displacement.

Another significant patent by Liu is the "Heat slug for package structure." This invention provides a heat slug that consists of a main body and several protrusions. The main body has a surface with at least one defined ditch, while each protrusion extends from the main body and features a surface with multiple dimples. This design enhances the efficiency of heat dissipation in package structures.

Career Highlights

Cheng-Cheng Liu is currently employed at Advanced Semiconductor Engineering, Inc., where he applies his expertise in semiconductor technology. His work has been instrumental in developing advanced solutions that enhance the performance and reliability of semiconductor devices.

Collaborations

Liu collaborates with talented individuals in his field, including coworkers Jun-Cheng Liu and Hsin-hao Chen. Their combined efforts contribute to the innovative environment at Advanced Semiconductor Engineering, Inc.

Conclusion

Cheng-Cheng Liu's contributions to semiconductor engineering through his patents demonstrate his commitment to innovation and technology advancement. His work continues to influence the industry and pave the way for future developments.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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