The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2008
Filed:
Dec. 21, 2005
Pai-chou Liu, Kaoshiung, TW;
Jun-cheng Liu, Kaoshiung, TW;
Kenneth Kinhang Ku, Kaoshiung, TW;
Yu-li Chung, Kaoshiung, TW;
Pai-Chou Liu, Kaoshiung, TW;
Jun-Cheng Liu, Kaoshiung, TW;
Kenneth Kinhang Ku, Kaoshiung, TW;
Yu-Li Chung, Kaoshiung, TW;
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Abstract
A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink is disposed on a first side of the leadframe and has a plurality of first positioning portions. The second heatsink is disposed on a second side of the leadframe. The second heatsink has a plurality of second positioning portions. The second positioning portions correspond to the first positioning portions of the first heatsink, whereby the warping problem of the leadframe is resolved.