Miaoli, Taiwan

Jui-Meng Jao


Average Co-Inventor Count = 2.2

ph-index = 5

Forward Citations = 119(Granted Patents)


Location History:

  • Miaoli, TW (2001 - 2002)
  • Miaoli Hsien, TW (2002)

Company Filing History:


Years Active: 2001-2002

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6 patents (USPTO):Explore Patents

Title: Innovations of Jui-Meng Jao in Solder Bump Technology

Introduction

Jui-Meng Jao is a notable inventor based in Miaoli, Taiwan. He has made significant contributions to the field of solder bump technology, holding a total of 6 patents. His work focuses on improving the coplanarity and structural integrity of solder bumps used in integrated circuits.

Latest Patents

Jui-Meng Jao's latest patents include a structure of solder bumps with improved coplanarity and a method of forming solder bumps with improved coplanarity. The patented structure comprises a substrate, a passivation layer, multiple Under Ball Metallurgy (UBM) layers, and solder bumps. The substrate features an active surface with bonding pads, while the UBM layers are electrically connected to these pads. The solder bumps are formed with uniform height on the UBM layers, enhancing coplanarity. Additionally, his method of forming solder bumps utilizes a UBM structure with various sizes of openings to control solder volume, ensuring uniform heights and improved coplanarity. Another innovative method proposed by Jao involves forming solder areas over a lead frame through the deposition of an oxidation layer, which is more cost-effective and reduces the risk of cracking in integrated circuit packages.

Career Highlights

Throughout his career, Jui-Meng Jao has worked with prominent companies such as Siliconware Precision Industries Co., Ltd. and Siliconware Precision Industries, Ltd. His expertise in solder bump technology has positioned him as a key figure in the industry.

Collaborations

Jui-Meng Jao has collaborated with notable colleagues, including Eric Ko and Chien-Ping Huang, who is a woman. These collaborations have further enriched his work and contributions to the field.

Conclusion

Jui-Meng Jao's innovations in solder bump technology demonstrate his commitment to enhancing the performance and reliability of integrated circuits. His patents reflect a deep understanding of the challenges in the industry and provide effective solutions.

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