The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2001
Filed:
Dec. 22, 1999
Chien-Ping Huang, Hsinchu Hsien, TW;
Jui-Meng Jao, Miaoli, TW;
Siliconware Precision Industries, Taichung, TW;
Abstract
A heat-dissipating device is designed for use in an integrated circuit package for heat dissipation. The heat-dissipating device is a molded piece of a heat-conductive material, having an exterior side which is to be exposed to the outside of the integrated circuit package. The heat-dissipating device is characterized in the forming of a staircase-like cutaway part at the edge of the exterior side thereof, which is formed with a plurality of stepped surfaces. During the molding process, the staircase-like cutaway part can help slow down the flowing speed of the encapsulation resin flow, so that the resin flow would hardly flash onto the exterior side of the heat-conductive device. In addition, the staircase-like form of the cutaway part provides a lengthier path that would hardly allow outside moisture to penetrate to the inside of the integrated circuit package and cause popcorn effect in the integrated circuit package. The manufactured integrated circuit package is therefore more reliable to use.